A revolutionary material - for ultra-high density data storage capacity with minimal fabrication costs
The Technology
This invention is a revolutionary matrix material that can be developed into a super performance USB stick or memory product.
With the plethora of USB sticks and other storage capacity devices on the market today, computer component manufacturers take note - this higher density, non-volatile data storage material - has low fabrication costs.
This material even has potential to revolutionise computer component manufacturing!
This invention details a concept and design of novel resistive random access memory devices with multi-level capability and ultra-small cell size (<5 nm) for the applications of high density, high-speed non-volatile memories.
Key Benefits
- Ultra-small memory cell
- Multi-level, high density data storage
- Non-volatile memory
- Room temperature processing
- Cost saving - low cost fabrication
- Flexible substrates
Applications
- Random access memory
- Thin film transistors
Opportunity
A superb opportunity for a manufacturer to capitalise on the potential efficiencies and costs savings to be created by this disruptive technology.
This technology is available as an Easy Access licence to companies and individuals for free.
Please download the PDF of this Technology Brief